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The national standard GB/T 45716.1 2026 has been published, establishing a rapid BTI reliability test method for MOSFETs

2026.08.22
The domestic power module packaging capability continues to improve, and the verification and introduction of automotive-grade modules are accelerating

2026.08.22
The photovoltaic industry continues to develop with high quality, and the penetration rate of domestically produced power devices in the inverter field is continuously increasing

2026.08.22
In 2026, the global newly installed capacity of energy storage will grow rapidly, and high-voltage power devices will usher in large-scale applications

2026.08.22
China's exports of integrated circuits in the first half of the year increased by 88.7% year-on-year

2026.08.22
Build the world's largest AI chip

2026.08.22
Under the heat of EMIB, advanced packaging has entered a period of intense competition

2026.08.22
Significant progress has been made in the field of new semiconductor materials

2026.08.22
Huawei officially unveiled a new law in the semiconductor field, stating that transistor density and system performance have achieved new breakthroughs through logic folding technology

2026.08.22

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