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Products
Trench MOSFET
SGT MOSFET
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The national standard GB/T 45716.1 2026 has been published, establishing a rapid BTI reliability test method for MOSFETs
2026.08.22
The domestic power module packaging capability continues to improve, and the verification and introduction of automotive-grade modules are accelerating
2026.08.22
The photovoltaic industry continues to develop with high quality, and the penetration rate of domestically produced power devices in the inverter field is continuously increasing
2026.08.22
In 2026, the global newly installed capacity of energy storage will grow rapidly, and high-voltage power devices will usher in large-scale applications
2026.08.22
China's exports of integrated circuits in the first half of the year increased by 88.7% year-on-year
2026.08.22
Build the world's largest AI chip
2026.08.22
Under the heat of EMIB, advanced packaging has entered a period of intense competition
2026.08.22
Significant progress has been made in the field of new semiconductor materials
2026.08.22
Huawei officially unveiled a new law in the semiconductor field, stating that transistor density and system performance have achieved new breakthroughs through logic folding technology
2026.08.22
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